Bondller New Material Technology Co., Ltd. was established in 2011. The company boasts a dedicated team for research and development, production, and sales, supported by partnerships with leading domestic universities and research institutions. By integrating cutting-edge adhesive technologies from both domestic and international sources with modern management practices, Bondller focuses on delivering a wide range of reliable and stable adhesive products tailored for the electronics industry. The company has earned the trust of numerous well-known enterprises both in China and internationally.