Thermal Management Materials

Enable optimal performance in electronic devices and applications while effectively managing heat with Bondller thermal management materials.

Thermal management materials are a range of different product types designed to effectively dissipate heat in electronic applications. They are composite systems that enable efficient heat transfer within components.

These solutions perform various functions within components. This includes carrying heat away from the components that generate it (also known as dissipating heat), offering stress relief from thermal cycling, providing electrical insulation, filling gaps, and offering long-term stability within components.

Find Bondller Thermal Management Products:

  • Thermal Gap Fillers
  • Thermal GAP PAD
  • Phase Change Materials
  • Thermal Conductive Tapes